Development of High Precise and Efficient Slicing Technology by using Unidirectional Multi-Wire-Saw

A slicing technology based on new concept of Multi-Wire-Saw has been developed for high precision and efficiency. This technology is composed of new driving system and new temperature control system. First, to achieve high efficiency, unidirectional wire driving system was adopted. In this system, a...

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Veröffentlicht in:	Journal of the Japan Society for Precision Engineering 1990/06/05, Vol.56(6), pp.1052-1057
Hauptverfasser:	KOJIMA, Masayasu, TOMIZAWA, Atsushi, TAKASE, Junichi, HATTORI, Hideo, MITANI, Mitsuo
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Multi-Wire-Saw Si wafer slicing technology temperature control unidirectinal wire drive
Online-Zugang:	Volltext
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