Development of High Precise and Efficient Slicing Technology by using Unidirectional Multi-Wire-Saw

A slicing technology based on new concept of Multi-Wire-Saw has been developed for high precision and efficiency. This technology is composed of new driving system and new temperature control system. First, to achieve high efficiency, unidirectional wire driving system was adopted. In this system, a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of the Japan Society for Precision Engineering 1990/06/05, Vol.56(6), pp.1052-1057
Hauptverfasser: KOJIMA, Masayasu, TOMIZAWA, Atsushi, TAKASE, Junichi, HATTORI, Hideo, MITANI, Mitsuo
Format: Artikel
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 1057
container_issue 6
container_start_page 1052
container_title Journal of the Japan Society for Precision Engineering
container_volume 56
creator KOJIMA, Masayasu
TOMIZAWA, Atsushi
TAKASE, Junichi
HATTORI, Hideo
MITANI, Mitsuo
description A slicing technology based on new concept of Multi-Wire-Saw has been developed for high precision and efficiency. This technology is composed of new driving system and new temperature control system. First, to achieve high efficiency, unidirectional wire driving system was adopted. In this system, a very long wire is driven in only one direction at high speed (max 600 m/min), while a wire is driven reciprocally in coventional Multi-Wire-Saw. Second, to achieve high slicing precision, temperature control system has been newly developed, in which cooling oil is circulated to keep the temperature constant on the grooved roller surface during slicing. This system has made it possible to stabilize positions of wire and to minimize wafer bow caused by thermal expansion of grooved rollers during slicing.
doi_str_mv 10.2493/jjspe.56.1052
format Article
fullrecord <record><control><sourceid>jstage_cross</sourceid><recordid>TN_cdi_crossref_primary_10_2493_jjspe_56_1052</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>article_jjspe1986_56_6_56_6_1052_article_char_en</sourcerecordid><originalsourceid>FETCH-LOGICAL-c2672-fa506ae3ccdb1fbbb32945fa063e0fc6e63246286639895aaa9eeb5b1f026a883</originalsourceid><addsrcrecordid>eNo9kMFuwjAMhqNpk4YYx93zAmFpQkJynBiMSUybBGi7VW5wSlBpUVM28fZrB-JiW_b3W_ZPyGPCh2Jk5dNuFw84VHqYcCVuSC8xRjA9Vt-3pMdtIhgXxt6TQYwh41zoMRdS9Ih7wR8sqsMey4ZWns5DvqWfNboQkUK5oVPvgwvddFm0RZnTFbptWRVVfqLZiR5j11uXYRNaVROqEgr6fiyawL7aDlvC7wO581BEHFxyn6xn09VkzhYfr2-T5wVz7TmCeVBcA0rnNlnisyyTwo6UB64lcu80ailGWhitpTVWAYBFzFTLtu-AMbJP2Hmvq6sYa_TpoQ57qE9pwtPOpPTfpFTptDOp5WdnfhcbyPFKQ90EV-CZTqzRneISOuEVcFuoUyzlH9Ifdb8</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Development of High Precise and Efficient Slicing Technology by using Unidirectional Multi-Wire-Saw</title><source>EZB-FREE-00999 freely available EZB journals</source><creator>KOJIMA, Masayasu ; TOMIZAWA, Atsushi ; TAKASE, Junichi ; HATTORI, Hideo ; MITANI, Mitsuo</creator><creatorcontrib>KOJIMA, Masayasu ; TOMIZAWA, Atsushi ; TAKASE, Junichi ; HATTORI, Hideo ; MITANI, Mitsuo</creatorcontrib><description>A slicing technology based on new concept of Multi-Wire-Saw has been developed for high precision and efficiency. This technology is composed of new driving system and new temperature control system. First, to achieve high efficiency, unidirectional wire driving system was adopted. In this system, a very long wire is driven in only one direction at high speed (max 600 m/min), while a wire is driven reciprocally in coventional Multi-Wire-Saw. Second, to achieve high slicing precision, temperature control system has been newly developed, in which cooling oil is circulated to keep the temperature constant on the grooved roller surface during slicing. This system has made it possible to stabilize positions of wire and to minimize wafer bow caused by thermal expansion of grooved rollers during slicing.</description><identifier>ISSN: 0912-0289</identifier><identifier>EISSN: 1882-675X</identifier><identifier>DOI: 10.2493/jjspe.56.1052</identifier><language>eng ; jpn</language><publisher>The Japan Society for Precision Engineering</publisher><subject>Multi-Wire-Saw ; Si wafer ; slicing technology ; temperature control ; unidirectinal wire drive</subject><ispartof>Journal of the Japan Society for Precision Engineering, 1990/06/05, Vol.56(6), pp.1052-1057</ispartof><rights>by The Japan Society for Precision Engineering</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,4024,27923,27924,27925</link.rule.ids></links><search><creatorcontrib>KOJIMA, Masayasu</creatorcontrib><creatorcontrib>TOMIZAWA, Atsushi</creatorcontrib><creatorcontrib>TAKASE, Junichi</creatorcontrib><creatorcontrib>HATTORI, Hideo</creatorcontrib><creatorcontrib>MITANI, Mitsuo</creatorcontrib><title>Development of High Precise and Efficient Slicing Technology by using Unidirectional Multi-Wire-Saw</title><title>Journal of the Japan Society for Precision Engineering</title><addtitle>Journal of the Japan Society for Precision Engineering</addtitle><description>A slicing technology based on new concept of Multi-Wire-Saw has been developed for high precision and efficiency. This technology is composed of new driving system and new temperature control system. First, to achieve high efficiency, unidirectional wire driving system was adopted. In this system, a very long wire is driven in only one direction at high speed (max 600 m/min), while a wire is driven reciprocally in coventional Multi-Wire-Saw. Second, to achieve high slicing precision, temperature control system has been newly developed, in which cooling oil is circulated to keep the temperature constant on the grooved roller surface during slicing. This system has made it possible to stabilize positions of wire and to minimize wafer bow caused by thermal expansion of grooved rollers during slicing.</description><subject>Multi-Wire-Saw</subject><subject>Si wafer</subject><subject>slicing technology</subject><subject>temperature control</subject><subject>unidirectinal wire drive</subject><issn>0912-0289</issn><issn>1882-675X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1990</creationdate><recordtype>article</recordtype><recordid>eNo9kMFuwjAMhqNpk4YYx93zAmFpQkJynBiMSUybBGi7VW5wSlBpUVM28fZrB-JiW_b3W_ZPyGPCh2Jk5dNuFw84VHqYcCVuSC8xRjA9Vt-3pMdtIhgXxt6TQYwh41zoMRdS9Ih7wR8sqsMey4ZWns5DvqWfNboQkUK5oVPvgwvddFm0RZnTFbptWRVVfqLZiR5j11uXYRNaVROqEgr6fiyawL7aDlvC7wO581BEHFxyn6xn09VkzhYfr2-T5wVz7TmCeVBcA0rnNlnisyyTwo6UB64lcu80ailGWhitpTVWAYBFzFTLtu-AMbJP2Hmvq6sYa_TpoQ57qE9pwtPOpPTfpFTptDOp5WdnfhcbyPFKQ90EV-CZTqzRneISOuEVcFuoUyzlH9Ifdb8</recordid><startdate>1990</startdate><enddate>1990</enddate><creator>KOJIMA, Masayasu</creator><creator>TOMIZAWA, Atsushi</creator><creator>TAKASE, Junichi</creator><creator>HATTORI, Hideo</creator><creator>MITANI, Mitsuo</creator><general>The Japan Society for Precision Engineering</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>1990</creationdate><title>Development of High Precise and Efficient Slicing Technology by using Unidirectional Multi-Wire-Saw</title><author>KOJIMA, Masayasu ; TOMIZAWA, Atsushi ; TAKASE, Junichi ; HATTORI, Hideo ; MITANI, Mitsuo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2672-fa506ae3ccdb1fbbb32945fa063e0fc6e63246286639895aaa9eeb5b1f026a883</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng ; jpn</language><creationdate>1990</creationdate><topic>Multi-Wire-Saw</topic><topic>Si wafer</topic><topic>slicing technology</topic><topic>temperature control</topic><topic>unidirectinal wire drive</topic><toplevel>online_resources</toplevel><creatorcontrib>KOJIMA, Masayasu</creatorcontrib><creatorcontrib>TOMIZAWA, Atsushi</creatorcontrib><creatorcontrib>TAKASE, Junichi</creatorcontrib><creatorcontrib>HATTORI, Hideo</creatorcontrib><creatorcontrib>MITANI, Mitsuo</creatorcontrib><collection>CrossRef</collection><jtitle>Journal of the Japan Society for Precision Engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>KOJIMA, Masayasu</au><au>TOMIZAWA, Atsushi</au><au>TAKASE, Junichi</au><au>HATTORI, Hideo</au><au>MITANI, Mitsuo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Development of High Precise and Efficient Slicing Technology by using Unidirectional Multi-Wire-Saw</atitle><jtitle>Journal of the Japan Society for Precision Engineering</jtitle><addtitle>Journal of the Japan Society for Precision Engineering</addtitle><date>1990</date><risdate>1990</risdate><volume>56</volume><issue>6</issue><spage>1052</spage><epage>1057</epage><pages>1052-1057</pages><issn>0912-0289</issn><eissn>1882-675X</eissn><abstract>A slicing technology based on new concept of Multi-Wire-Saw has been developed for high precision and efficiency. This technology is composed of new driving system and new temperature control system. First, to achieve high efficiency, unidirectional wire driving system was adopted. In this system, a very long wire is driven in only one direction at high speed (max 600 m/min), while a wire is driven reciprocally in coventional Multi-Wire-Saw. Second, to achieve high slicing precision, temperature control system has been newly developed, in which cooling oil is circulated to keep the temperature constant on the grooved roller surface during slicing. This system has made it possible to stabilize positions of wire and to minimize wafer bow caused by thermal expansion of grooved rollers during slicing.</abstract><pub>The Japan Society for Precision Engineering</pub><doi>10.2493/jjspe.56.1052</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record>
fulltext fulltext
identifier ISSN: 0912-0289
ispartof Journal of the Japan Society for Precision Engineering, 1990/06/05, Vol.56(6), pp.1052-1057
issn 0912-0289
1882-675X
language eng ; jpn
recordid cdi_crossref_primary_10_2493_jjspe_56_1052
source EZB-FREE-00999 freely available EZB journals
subjects Multi-Wire-Saw
Si wafer
slicing technology
temperature control
unidirectinal wire drive
title Development of High Precise and Efficient Slicing Technology by using Unidirectional Multi-Wire-Saw
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T22%3A20%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-jstage_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Development%20of%20High%20Precise%20and%20Efficient%20Slicing%20Technology%20by%20using%20Unidirectional%20Multi-Wire-Saw&rft.jtitle=Journal%20of%20the%20Japan%20Society%20for%20Precision%20Engineering&rft.au=KOJIMA,%20Masayasu&rft.date=1990&rft.volume=56&rft.issue=6&rft.spage=1052&rft.epage=1057&rft.pages=1052-1057&rft.issn=0912-0289&rft.eissn=1882-675X&rft_id=info:doi/10.2493/jjspe.56.1052&rft_dat=%3Cjstage_cross%3Earticle_jjspe1986_56_6_56_6_1052_article_char_en%3C/jstage_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true