Characteristic Wettability of SiC by Liquid Pure Cu

The wettabilities of α-SiC, hot pressed SiC, and reaction bonded SiC by liquid Cu were investigated using the sessile drop method under various experimental conditions. The main results obtained are summarized as follows: (1) The contact angle of liquid Cu on SiC depended on SiC used. (2) The characteristic wetting was observed in the liquid pure Cu/α-SiC system, which had a hexagonal wetted area. (3) The appearance of hexagonal wetting depended on temperature and pressure: at lower temperatures and pressures, hexagonal wetting was observed, and at relatively higher temperatures and pressures, normal wetting was observed. (4) The mechanism of the formation of hexagonal wetting is closely related to that of hexagonal etch pits by fused KOH solution.