Development of Cr-Cu Composites for Heat-sink of Semiconductor Devices

Development of Cr-Cu Composites for Heat-sink of Semiconductor Devices

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Veröffentlicht in:Materia (Sendai. 1994) 2014, Vol.53(2), pp.66-68
Hauptverfasser: Terao, Hoshiaki, Wada, Hiroshi, Kobiki, Hideaki, Ota, Hiroki, Matsubara, Yukihiro
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container_end_page 68
container_issue 2
container_start_page 66
container_title Materia (Sendai. 1994)
container_volume 53
creator Terao, Hoshiaki
Wada, Hiroshi
Kobiki, Hideaki
Ota, Hiroki
Matsubara, Yukihiro
description
doi_str_mv 10.2320/materia.53.66
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title Development of Cr-Cu Composites for Heat-sink of Semiconductor Devices
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