Low-Temperature Cu-Cu Bonding Using Spark Plasma Sintering System

Diffusion bonding of Cu bars without high vacuum and super-flatening bonding surface was investigated using spark plasma sintering (SPS) system for low-cost Cu-bulk-joint products. Oxygen-free Cu bars were set in graphite jigs, and were moderately compressed due to thermal expansion difference betwe...

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Veröffentlicht in:	QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 2015, Vol.33(2), pp.185s-189s
Hauptverfasser:	Ito, Kazuhiro, Kohama, Kazuyuki, Saito, Tadashi
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Copper Diffusion Bonding Electrical Resistivity Spark Plasma Sintering Tensile Strength
Online-Zugang:	Volltext
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