Brittle Properties of Copper Base Lead Frame at Soldered Joint

Copper base alloys, containing 2.4mass%Fe and 0.1mass%Zn, etc, were soldered using Pb-63%mass%Sn and then heated at 100°C, 125°C and 150°C for 1000-2000h to grow intermetallic compounds at the solder/alloy interfase. Elemental analysis at the interfase was performed by using EPMA. The fractured inte...

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Veröffentlicht in:	QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 1998/02/05, Vol.16(1), pp.105-109
Hauptverfasser:	HARAMAKI, Takashi, NAKAMURA, Mitsuo, MITA, Mamoru
Format:	Artikel
Sprache:	jpn
Schlagworte:	Intermetalic compound Lead frame Microjoint Peel strength Solderring
Online-Zugang:	Volltext
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