Peel Strength of microsoldered layer at leadframe microjoining: A study on microjoining of leadframe for LSI package (No.1)

Representative electric parts, LSI packages are turning to more fine pitch and more high pin count based on the demands of package size reduction which is coming from needs of smaller electric components. This reserch work has originated from high density LSI package surface mounting, including micr...

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Veröffentlicht in:	QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 1996/05/05, Vol.14(2), pp.449-453
Hauptverfasser:	Mita, Mamoru, Haramaki, Takashi, Okada, Hiroshi
Format:	Artikel
Sprache:	jpn
Schlagworte:	In the air Intermetallic compound Joint strength Microjoint Microstructure Soldering
Online-Zugang:	Volltext
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