Electromigration Phenomenon in Solder Joint

Electromigration Phenomenon in Solder Joint

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:JOURNAL OF THE JAPAN WELDING SOCIETY 2018, Vol.87(7), pp.503-507
1. Verfasser: KADOGUCHI, Takuya
Format: Artikel
Sprache:eng ; jpn
Schlagworte:
ECU
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 507
container_issue 7
container_start_page 503
container_title JOURNAL OF THE JAPAN WELDING SOCIETY
container_volume 87
creator KADOGUCHI, Takuya
description
doi_str_mv 10.2207/jjws.87.503
format Article
fullrecord <record><control><sourceid>jstage_cross</sourceid><recordid>TN_cdi_crossref_primary_10_2207_jjws_87_503</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>article_jjws_87_7_87_503_article_char_en</sourcerecordid><originalsourceid>FETCH-LOGICAL-c161t-b391ee133268ae2cff12130bb7b27fced683e8ed9bdf0f75d103d2c9439f92da3</originalsourceid><addsrcrecordid>eNo9j11LwzAUhoMoWOau_AO9H60nSdukN4KM6ZSBgnod0uRkS-mHJAXx37ux0YvDe3Ge94WHkHsKOWMgHtr2N-ZS5CXwK5JQKXkmGBTXJAFgNCuEFLdkGaNvAKDmgskyIatNh2YKY-_3QU9-HNKPAw5jf7wh9UP6OXYWQ_o2-mG6IzdOdxGXl1yQ7-fN13qb7d5fXtdPu8zQik5Zw2uKSDlnldTIjHOUUQ5NIxomnEFbSY4Sbd1YB06UlgK3zNQFr13NrOYLsjrvmjDGGNCpn-B7Hf4UBXVSVSdVJYU6qh7pxzPdxknvcWZ1mLzpcGbFpTA_zEEHhQP_BwjXXp0</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Electromigration Phenomenon in Solder Joint</title><source>Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals</source><source>J-STAGE (Japan Science &amp; Technology Information Aggregator, Electronic) Freely Available Titles - Japanese</source><creator>KADOGUCHI, Takuya</creator><creatorcontrib>KADOGUCHI, Takuya</creatorcontrib><identifier>ISSN: 0021-4787</identifier><identifier>EISSN: 1883-7204</identifier><identifier>DOI: 10.2207/jjws.87.503</identifier><language>eng ; jpn</language><publisher>JAPAN WELDING SOCIETY</publisher><subject>ECU</subject><ispartof>JOURNAL OF THE JAPAN WELDING SOCIETY, 2018, Vol.87(7), pp.503-507</ispartof><rights>2018 JAPAN WELDING SOCIETY</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c161t-b391ee133268ae2cff12130bb7b27fced683e8ed9bdf0f75d103d2c9439f92da3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,1881,4021,27921,27922,27923</link.rule.ids></links><search><creatorcontrib>KADOGUCHI, Takuya</creatorcontrib><title>Electromigration Phenomenon in Solder Joint</title><title>JOURNAL OF THE JAPAN WELDING SOCIETY</title><addtitle>JOURNAL OF THE JAPAN WELDING SOCIETY</addtitle><subject>ECU</subject><issn>0021-4787</issn><issn>1883-7204</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><recordid>eNo9j11LwzAUhoMoWOau_AO9H60nSdukN4KM6ZSBgnod0uRkS-mHJAXx37ux0YvDe3Ge94WHkHsKOWMgHtr2N-ZS5CXwK5JQKXkmGBTXJAFgNCuEFLdkGaNvAKDmgskyIatNh2YKY-_3QU9-HNKPAw5jf7wh9UP6OXYWQ_o2-mG6IzdOdxGXl1yQ7-fN13qb7d5fXtdPu8zQik5Zw2uKSDlnldTIjHOUUQ5NIxomnEFbSY4Sbd1YB06UlgK3zNQFr13NrOYLsjrvmjDGGNCpn-B7Hf4UBXVSVSdVJYU6qh7pxzPdxknvcWZ1mLzpcGbFpTA_zEEHhQP_BwjXXp0</recordid><startdate>2018</startdate><enddate>2018</enddate><creator>KADOGUCHI, Takuya</creator><general>JAPAN WELDING SOCIETY</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>2018</creationdate><title>Electromigration Phenomenon in Solder Joint</title><author>KADOGUCHI, Takuya</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c161t-b391ee133268ae2cff12130bb7b27fced683e8ed9bdf0f75d103d2c9439f92da3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng ; jpn</language><creationdate>2018</creationdate><topic>ECU</topic><toplevel>online_resources</toplevel><creatorcontrib>KADOGUCHI, Takuya</creatorcontrib><collection>CrossRef</collection><jtitle>JOURNAL OF THE JAPAN WELDING SOCIETY</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>KADOGUCHI, Takuya</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electromigration Phenomenon in Solder Joint</atitle><jtitle>JOURNAL OF THE JAPAN WELDING SOCIETY</jtitle><addtitle>JOURNAL OF THE JAPAN WELDING SOCIETY</addtitle><date>2018</date><risdate>2018</risdate><volume>87</volume><issue>7</issue><spage>503</spage><epage>507</epage><pages>503-507</pages><issn>0021-4787</issn><eissn>1883-7204</eissn><pub>JAPAN WELDING SOCIETY</pub><doi>10.2207/jjws.87.503</doi><tpages>5</tpages></addata></record>
fulltext fulltext
identifier ISSN: 0021-4787
ispartof JOURNAL OF THE JAPAN WELDING SOCIETY, 2018, Vol.87(7), pp.503-507
issn 0021-4787
1883-7204
language eng ; jpn
recordid cdi_crossref_primary_10_2207_jjws_87_503
source Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals; J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese
subjects ECU
title Electromigration Phenomenon in Solder Joint
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T20%3A48%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-jstage_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Electromigration%20Phenomenon%20in%20Solder%20Joint&rft.jtitle=JOURNAL%20OF%20THE%20JAPAN%20WELDING%20SOCIETY&rft.au=KADOGUCHI,%20Takuya&rft.date=2018&rft.volume=87&rft.issue=7&rft.spage=503&rft.epage=507&rft.pages=503-507&rft.issn=0021-4787&rft.eissn=1883-7204&rft_id=info:doi/10.2207/jjws.87.503&rft_dat=%3Cjstage_cross%3Earticle_jjws_87_7_87_503_article_char_en%3C/jstage_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true