Micro-Interconnection(Japan Institute of Electronics Packaging): Trends of Micro-Interconnect Technology in Smaller IC Chip Electrodes

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Veröffentlicht in:	JOURNAL OF THE JAPAN WELDING SOCIETY 2013, Vol.82(1), pp.72-80
1. Verfasser:	HONDA, Susumu
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	MCP SiP TSV
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source	J-STAGE Free; Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals
subjects	MCP SiP TSV
title	Micro-Interconnection(Japan Institute of Electronics Packaging): Trends of Micro-Interconnect Technology in Smaller IC Chip Electrodes
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