Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W

Sputtered copper and tungsten thin films both with and without tungsten and chromium superlayers were tested by using nanoindentation probing to initiate and drive delamination. The adhesion energies of the films were calculated from the induced delaminations using the analysis presented in “Quantit...

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Veröffentlicht in:	Journal of Materials Research 1999-07, Vol.14 (7), p.3019-3026
Hauptverfasser:	Kriese, Michael D., Gerberich, William W., Moody, Neville R.
Format:	Artikel
Sprache:	eng
Schlagworte:	ADHESION CHROMIUM COPPER CRACKS ENGINEERING NOT INCLUDED IN OTHER CATEGORIES FRACTURE PROPERTIES INTERFACES MATERIALS SCIENCE MECHANICAL TESTS THIN FILMS TUNGSTEN
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