Packaging Technology for Sensor and Actuator MEMS Devices

This paper reports key issues of packaging for sensor and actuator MEMS (Micro Electro Mechanical Systems) devices. In this paper, we focus on the two types of MEMS devices, the sensor MEMS and the actuator MEMS. In the case of sensor MEMS packaging, the thermal stress is the most important in order...

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Veröffentlicht in:	IEEJ Transactions on Sensors and Micromachines 2004, Vol.124(2), pp.43-48
Hauptverfasser:	Masai, Taku, Sasaki, Syo, Imanaka, Koichi
Format:	Artikel
Sprache:	eng
Schlagworte:	Insertion loss mass-flow sensor pressure sensor sealing wafer-level Packaging
Online-Zugang:	Volltext
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