Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
The morphology and growth kinetics of the intermetallic compound formed during the reaction between liquid Sn-20In-2.8Ag solder and Ag substrate are studied in the temperature range 225–325 °C. The results indicate that the intermetallic compound Ag (In, Sn) of scallop shape appears at the interface...
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| Veröffentlicht in: | International journal of materials research 2022-02, Vol.93 (12), p.1194-1198 |
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| container_end_page | 1198 |
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| container_issue | 12 |
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| container_title | International journal of materials research |
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| creator | Chiang, M. J. Chuang, T. H. |
| description | The morphology and growth kinetics of the intermetallic compound formed during the reaction between liquid Sn-20In-2.8Ag solder and Ag substrate are studied in the temperature range 225–325 °C. The results indicate that the intermetallic compound Ag
(In, Sn) of scallop shape appears at the interface. The intermetallic thickness versus reaction time shows a parabolic relation, indicating that the growth of this intermetallic is diffusion-controlled. The activation energy calculated from the Arrhenius plot of the intermetallic growth rate is 41.6 kJ/mol. By marking the original interface with a Ta thin film, the dissolution of Ag into solder and the growth mechanism of the intermetallic compound have been clarified. |
| doi_str_mv | 10.1515/ijmr-2002-0207 |
| format | Article |
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(In, Sn) of scallop shape appears at the interface. The intermetallic thickness versus reaction time shows a parabolic relation, indicating that the growth of this intermetallic is diffusion-controlled. The activation energy calculated from the Arrhenius plot of the intermetallic growth rate is 41.6 kJ/mol. By marking the original interface with a Ta thin film, the dissolution of Ag into solder and the growth mechanism of the intermetallic compound have been clarified.</description><identifier>ISSN: 1862-5282</identifier><identifier>EISSN: 2195-8556</identifier><identifier>DOI: 10.1515/ijmr-2002-0207</identifier><language>eng</language><publisher>De Gruyter</publisher><subject>Ag substrate ; Diffusion soldering ; Intermetallic compounds ; Sn-20In-2.8Ag solder</subject><ispartof>International journal of materials research, 2022-02, Vol.93 (12), p.1194-1198</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c1303-6daedae01a0a05f3a6898ca99d9fe68bf28189e4ba7a97f3842476aeda8ae2243</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.degruyter.com/document/doi/10.1515/ijmr-2002-0207/pdf$$EPDF$$P50$$Gwalterdegruyter$$H</linktopdf><linktohtml>$$Uhttps://www.degruyter.com/document/doi/10.1515/ijmr-2002-0207/html$$EHTML$$P50$$Gwalterdegruyter$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,66497,68281</link.rule.ids></links><search><creatorcontrib>Chiang, M. J.</creatorcontrib><creatorcontrib>Chuang, T. H.</creatorcontrib><title>Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate</title><title>International journal of materials research</title><description>The morphology and growth kinetics of the intermetallic compound formed during the reaction between liquid Sn-20In-2.8Ag solder and Ag substrate are studied in the temperature range 225–325 °C. The results indicate that the intermetallic compound Ag
(In, Sn) of scallop shape appears at the interface. The intermetallic thickness versus reaction time shows a parabolic relation, indicating that the growth of this intermetallic is diffusion-controlled. The activation energy calculated from the Arrhenius plot of the intermetallic growth rate is 41.6 kJ/mol. By marking the original interface with a Ta thin film, the dissolution of Ag into solder and the growth mechanism of the intermetallic compound have been clarified.</description><subject>Ag substrate</subject><subject>Diffusion soldering</subject><subject>Intermetallic compounds</subject><subject>Sn-20In-2.8Ag solder</subject><issn>1862-5282</issn><issn>2195-8556</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><recordid>eNp1kEtLw0AQgBdRsFavnvcPpO4ju9m9CKWoDRQ8qOdlksyWlDTR3YTSf--GehWGeRy-YeYj5JGzFVdcPbWHY8gEYyJjghVXZCG4VZlRSl-TBTdaZEoYcUvuYjwwprguxIKUZT9i8FC30NGAUI_t0NMKxxNiT7v2Z2ob-tGnvWVKK7Pe0zh0DQYKfUPnaariGGDEe3LjoYv48FeX5Ov15XOzzXbvb-VmvctqLpnMdAOYgnFgwJSXoI01NVjbWI_aVF4YbizmFRRgCy9NLvJCz4wBFCKXS7K67K3DEGNA775De4Rwdpy5WYSbRbhZhJtFJOD5ApygS782uA_TOTXuMEyhT6f-A1rJBec2l791NmVr</recordid><startdate>20220215</startdate><enddate>20220215</enddate><creator>Chiang, M. J.</creator><creator>Chuang, T. H.</creator><general>De Gruyter</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20220215</creationdate><title>Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate</title><author>Chiang, M. J. ; Chuang, T. H.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c1303-6daedae01a0a05f3a6898ca99d9fe68bf28189e4ba7a97f3842476aeda8ae2243</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>Ag substrate</topic><topic>Diffusion soldering</topic><topic>Intermetallic compounds</topic><topic>Sn-20In-2.8Ag solder</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chiang, M. J.</creatorcontrib><creatorcontrib>Chuang, T. H.</creatorcontrib><collection>CrossRef</collection><jtitle>International journal of materials research</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chiang, M. J.</au><au>Chuang, T. H.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate</atitle><jtitle>International journal of materials research</jtitle><date>2022-02-15</date><risdate>2022</risdate><volume>93</volume><issue>12</issue><spage>1194</spage><epage>1198</epage><pages>1194-1198</pages><issn>1862-5282</issn><eissn>2195-8556</eissn><abstract>The morphology and growth kinetics of the intermetallic compound formed during the reaction between liquid Sn-20In-2.8Ag solder and Ag substrate are studied in the temperature range 225–325 °C. The results indicate that the intermetallic compound Ag
(In, Sn) of scallop shape appears at the interface. The intermetallic thickness versus reaction time shows a parabolic relation, indicating that the growth of this intermetallic is diffusion-controlled. The activation energy calculated from the Arrhenius plot of the intermetallic growth rate is 41.6 kJ/mol. By marking the original interface with a Ta thin film, the dissolution of Ag into solder and the growth mechanism of the intermetallic compound have been clarified.</abstract><pub>De Gruyter</pub><doi>10.1515/ijmr-2002-0207</doi><tpages>5</tpages></addata></record> |
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| ispartof | International journal of materials research, 2022-02, Vol.93 (12), p.1194-1198 |
| issn | 1862-5282 2195-8556 |
| language | eng |
| recordid | cdi_crossref_primary_10_1515_ijmr_2002_0207 |
| source | De Gruyter journals |
| subjects | Ag substrate Diffusion soldering Intermetallic compounds Sn-20In-2.8Ag solder |
| title | Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate |
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