Fatigue Life Evaluation of Sn3Ag0.5Cu Solder Joints after High Temperature Holding

The decrease in fatigue life of solder joints under the high temperature environment is a major problem in semiconductor packages for automotive applications. To clarify the mechanism of the fatigue-life decrease, we carried out the mechanical cyclic fatigue test of the Sn-3mass%Ag-0.5mass%Cu solder...

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Veröffentlicht in:	TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 2012, Vol.78(793), pp.1314-1324
Hauptverfasser:	KAWANO, Kenya, NAKA, Yasuhiro, TANIE, Hisashi, KIMOTO, Ryosuke, YAMAMOTO, Kenichi
Format:	Artikel
Sprache:	eng
Schlagworte:	Finite Element Method Heat Treatments Low Cycle Fatigue Solder Joint
Online-Zugang:	Volltext
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