Evaluation of Fatigue Strength for Solder Joints on NSMD Pads in Electronic Packages(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

We developed a method for evaluating the life of solder joints for an electronic package with non-solder-mask-defined (NSMD) solder pads. Generally, the thermal-cycling life of a package with NSMD pads is longer than that of a package with solder-mask-defined (SMD) pads, which are usually used in pa...

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Veröffentlicht in:	Transactions of the Japan Society of Mechanical Engineers Series A 2009/07/25, Vol.75(755), pp.807-814
Hauptverfasser:	NAKA, Yasuhiro, YAGUCHI, Akihiro, TANIE, Hisashi, KIMOTO, Ryosuke, YAMAMOTO, Kenichi
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Fatigue Finite Element Method Life Prediction LSI Package NSMD Solder
Online-Zugang:	Volltext
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