Evaluation of Fatigue Strength for Solder Joints on NSMD Pads in Electronic Packages(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)
We developed a method for evaluating the life of solder joints for an electronic package with non-solder-mask-defined (NSMD) solder pads. Generally, the thermal-cycling life of a package with NSMD pads is longer than that of a package with solder-mask-defined (SMD) pads, which are usually used in pa...
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| Veröffentlicht in: | Transactions of the Japan Society of Mechanical Engineers Series A 2009/07/25, Vol.75(755), pp.807-814 |
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| container_issue | 755 |
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| container_title | Transactions of the Japan Society of Mechanical Engineers Series A |
| container_volume | 75 |
| creator | NAKA, Yasuhiro YAGUCHI, Akihiro TANIE, Hisashi KIMOTO, Ryosuke YAMAMOTO, Kenichi |
| description | We developed a method for evaluating the life of solder joints for an electronic package with non-solder-mask-defined (NSMD) solder pads. Generally, the thermal-cycling life of a package with NSMD pads is longer than that of a package with solder-mask-defined (SMD) pads, which are usually used in packages. However, the fractural mechanism of joints on NSMD pads has not been sufficiently investigated. Therefore, we conducted mechanical fatigue tests on the joints of NSMD pads. We found that the crack propagation behavior in NSMD joints is different from that in SMD, and found that the difference of that behavior causes the life span of NSMD joints to be longer than that of SMD. In addition, we found that the life of a package with NSMD pads can be predicted from the strain in the solder bumps that is analyzed by using a finite element method, which compares the relationships between the strain and life span in the mechanical test data, although the relationship between the strain and life in NSMD joints is different from that in SMD. |
| doi_str_mv | 10.1299/kikaia.75.807 |
| format | Article |
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Generally, the thermal-cycling life of a package with NSMD pads is longer than that of a package with solder-mask-defined (SMD) pads, which are usually used in packages. However, the fractural mechanism of joints on NSMD pads has not been sufficiently investigated. Therefore, we conducted mechanical fatigue tests on the joints of NSMD pads. We found that the crack propagation behavior in NSMD joints is different from that in SMD, and found that the difference of that behavior causes the life span of NSMD joints to be longer than that of SMD. In addition, we found that the life of a package with NSMD pads can be predicted from the strain in the solder bumps that is analyzed by using a finite element method, which compares the relationships between the strain and life span in the mechanical test data, although the relationship between the strain and life in NSMD joints is different from that in SMD.</description><identifier>ISSN: 0387-5008</identifier><identifier>EISSN: 1884-8338</identifier><identifier>DOI: 10.1299/kikaia.75.807</identifier><language>eng ; jpn</language><publisher>The Japan Society of Mechanical Engineers</publisher><subject>Fatigue ; Finite Element Method ; Life Prediction ; LSI Package ; NSMD ; Solder</subject><ispartof>Transactions of the Japan Society of Mechanical Engineers Series A, 2009/07/25, Vol.75(755), pp.807-814</ispartof><rights>2009 The Japan Society of Mechanical Engineers</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c2207-d8cf3bf67b6fb74bdb1ac27222a5ed6eca79cca4558077bb4ddc4d80aa5919ec3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>315,781,785,1884,4025,27925,27926,27927</link.rule.ids></links><search><creatorcontrib>NAKA, Yasuhiro</creatorcontrib><creatorcontrib>YAGUCHI, Akihiro</creatorcontrib><creatorcontrib>TANIE, Hisashi</creatorcontrib><creatorcontrib>KIMOTO, Ryosuke</creatorcontrib><creatorcontrib>YAMAMOTO, Kenichi</creatorcontrib><title>Evaluation of Fatigue Strength for Solder Joints on NSMD Pads in Electronic Packages(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)</title><title>Transactions of the Japan Society of Mechanical Engineers Series A</title><addtitle>JSMET</addtitle><description>We developed a method for evaluating the life of solder joints for an electronic package with non-solder-mask-defined (NSMD) solder pads. 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In addition, we found that the life of a package with NSMD pads can be predicted from the strain in the solder bumps that is analyzed by using a finite element method, which compares the relationships between the strain and life span in the mechanical test data, although the relationship between the strain and life in NSMD joints is different from that in SMD.</description><subject>Fatigue</subject><subject>Finite Element Method</subject><subject>Life Prediction</subject><subject>LSI Package</subject><subject>NSMD</subject><subject>Solder</subject><issn>0387-5008</issn><issn>1884-8338</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><recordid>eNpdkE9r3DAQxUVooUuSY-86pgdvJdmyZCiBkmyav23opmczksZeZR05SN5APlm-XrRsCKGCQXrDT2-YR8hXzuZcNM33tV-Dh7mSc83UHplxratCl6X-RGas1KqQjOkv5DAlbxgrueKsFjPysniCYQOTHwMdO3qWX_0G6XKKGPppRbsx0uU4OIz0cvRhSjSDv5c3p_QWXKI-0MWAdopj8Da37Bp6TEc_lo9oPQz0IqUNHt-tMD5kBcHRG7QryHCWf3HwYPzgp-ft7A9Gp_jkLf7PL0LvA2L0of92QD53MCQ8fLv3yb-zxd3JeXH959fFyc_rwgrBVOG07UrT1crUnVGVcYaDFUoIARJdjRZUYy1UUubUlDGVc7ZymgHIhjdoy31S7HxtHFOK2LWP0T9AfG45a7fBt7vgWyXbbJH52x1_n6YcxTsNcfJ2wDeaN6rZ_lByW-3VJctH1lIoxd_RvHdsMZSvqIOW9A</recordid><startdate>2009</startdate><enddate>2009</enddate><creator>NAKA, Yasuhiro</creator><creator>YAGUCHI, Akihiro</creator><creator>TANIE, Hisashi</creator><creator>KIMOTO, Ryosuke</creator><creator>YAMAMOTO, Kenichi</creator><general>The Japan Society of Mechanical Engineers</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>2009</creationdate><title>Evaluation of Fatigue Strength for Solder Joints on NSMD Pads in Electronic Packages(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)</title><author>NAKA, Yasuhiro ; YAGUCHI, Akihiro ; TANIE, Hisashi ; KIMOTO, Ryosuke ; YAMAMOTO, Kenichi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2207-d8cf3bf67b6fb74bdb1ac27222a5ed6eca79cca4558077bb4ddc4d80aa5919ec3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng ; jpn</language><creationdate>2009</creationdate><topic>Fatigue</topic><topic>Finite Element Method</topic><topic>Life Prediction</topic><topic>LSI Package</topic><topic>NSMD</topic><topic>Solder</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKA, Yasuhiro</creatorcontrib><creatorcontrib>YAGUCHI, Akihiro</creatorcontrib><creatorcontrib>TANIE, Hisashi</creatorcontrib><creatorcontrib>KIMOTO, Ryosuke</creatorcontrib><creatorcontrib>YAMAMOTO, Kenichi</creatorcontrib><collection>CrossRef</collection><jtitle>Transactions of the Japan Society of Mechanical Engineers Series A</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>NAKA, Yasuhiro</au><au>YAGUCHI, Akihiro</au><au>TANIE, Hisashi</au><au>KIMOTO, Ryosuke</au><au>YAMAMOTO, Kenichi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Evaluation of Fatigue Strength for Solder Joints on NSMD Pads in Electronic Packages(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)</atitle><jtitle>Transactions of the Japan Society of Mechanical Engineers Series A</jtitle><addtitle>JSMET</addtitle><date>2009</date><risdate>2009</risdate><volume>75</volume><issue>755</issue><spage>807</spage><epage>814</epage><pages>807-814</pages><issn>0387-5008</issn><eissn>1884-8338</eissn><abstract>We developed a method for evaluating the life of solder joints for an electronic package with non-solder-mask-defined (NSMD) solder pads. Generally, the thermal-cycling life of a package with NSMD pads is longer than that of a package with solder-mask-defined (SMD) pads, which are usually used in packages. However, the fractural mechanism of joints on NSMD pads has not been sufficiently investigated. Therefore, we conducted mechanical fatigue tests on the joints of NSMD pads. We found that the crack propagation behavior in NSMD joints is different from that in SMD, and found that the difference of that behavior causes the life span of NSMD joints to be longer than that of SMD. In addition, we found that the life of a package with NSMD pads can be predicted from the strain in the solder bumps that is analyzed by using a finite element method, which compares the relationships between the strain and life span in the mechanical test data, although the relationship between the strain and life in NSMD joints is different from that in SMD.</abstract><pub>The Japan Society of Mechanical Engineers</pub><doi>10.1299/kikaia.75.807</doi><tpages>8</tpages><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0387-5008 |
| ispartof | Transactions of the Japan Society of Mechanical Engineers Series A, 2009/07/25, Vol.75(755), pp.807-814 |
| issn | 0387-5008 1884-8338 |
| language | eng ; jpn |
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| source | Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals; J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese |
| subjects | Fatigue Finite Element Method Life Prediction LSI Package NSMD Solder |
| title | Evaluation of Fatigue Strength for Solder Joints on NSMD Pads in Electronic Packages(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering) |
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