Fatigue Properties and Dislocation Structures of Polycrystalline Copper Film

Fatigue properties of polycrystalline copper films subjected to pulsating stresses are investigated on the basis of observations of surface topography, fracture surface and dislocation structure. Fatigue limit corresponding to 107 cycles of a rolled copper film is 2. 3 times higher than that of an a...

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Veröffentlicht in:	TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 1994/06/25, Vol.60(574), pp.1325-1332
Hauptverfasser:	Kaneshiro, Hideo, Higa, Masaki, Makabe, Chobin, Katagiri, Kazumune, Itokazu, Masaya
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Copper Film Crack Initiation Dislocation Fatigue Fracture Surface Nonferrous Metal Pulsating Stress Subgrain Structure
Online-Zugang:	Volltext
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