Fatigue Properties and Dislocation Structures of Polycrystalline Copper Film
Fatigue properties of polycrystalline copper films subjected to pulsating stresses are investigated on the basis of observations of surface topography, fracture surface and dislocation structure. Fatigue limit corresponding to 107 cycles of a rolled copper film is 2. 3 times higher than that of an a...
Gespeichert in:
| Veröffentlicht in: | TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 1994/06/25, Vol.60(574), pp.1325-1332 |
|---|---|
| Hauptverfasser: | , , , , |
| Format: | Artikel |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1332 |
|---|---|
| container_issue | 574 |
| container_start_page | 1325 |
| container_title | TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A |
| container_volume | 60 |
| creator | Kaneshiro, Hideo Higa, Masaki Makabe, Chobin Katagiri, Kazumune Itokazu, Masaya |
| description | Fatigue properties of polycrystalline copper films subjected to pulsating stresses are investigated on the basis of observations of surface topography, fracture surface and dislocation structure. Fatigue limit corresponding to 107 cycles of a rolled copper film is 2. 3 times higher than that of an annealed one, but the fatigue limit ratio of the rolled specimen is lower than that of annealed one. From the observations of the surface crack and fracture surface, it is found that fatigue crack initiation and early-stage crack growth mechanisms of annealed bulk copper are not necessarily applicable to those of film. No striations are formed in both films. In annealed films, cell structures are formed under high-cycle fatigue whereas no band/ladder structures are formed. Dislocation structures near the fatigue crack in annealed films are similar to those of bulk specimens except for the absence of intensely elongated cells observed in the shear flow regions in the bulk specimen. No appreciable change during fatigue was found in the dislocation structures of rolled films. |
| doi_str_mv | 10.1299/kikaia.60.1325 |
| format | Article |
| fullrecord | <record><control><sourceid>jstage_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1299_kikaia_60_1325</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>article_kikaia1979_60_574_60_574_1325_article_char_en</sourcerecordid><originalsourceid>FETCH-LOGICAL-c2745-d2772c9330024e884b9ad67df881906dbe75fa3b863fb2de039851b8105076d43</originalsourceid><addsrcrecordid>eNo9kEtPAjEUhRujiQTZuu4fGOxj-loaFDWSSKKuJ522g5UyJe3Mgn9vCcjq5Oae7-bcA8A9RnNMlHrY-q32es7LSAm7AhMsZV1JSuU1mCAqRcUQkrdglrNvEaJYYMTJBKyWevCb0cF1inuXBu8y1L2FTz6HaMou9vBzSKMZxlRWsYPrGA4mHfKgQ_C9g4u4LyBc-rC7AzedDtnNzjoF38vnr8Vrtfp4eVs8ripDRM0qS4QgRlGKEKldydkqbbmwnZRYIW5bJ1inaSs57VpiHaJKMtxKjBgS3NZ0CuanuybFnJPrmn3yO50ODUbNsY7mVEfDy1jqKMD7CfgtsTfuYtflYRPc2Y6VUEeEifpfjvTFZX50alxP_wAZWW53</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Fatigue Properties and Dislocation Structures of Polycrystalline Copper Film</title><source>J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese</source><source>EZB-FREE-00999 freely available EZB journals</source><creator>Kaneshiro, Hideo ; Higa, Masaki ; Makabe, Chobin ; Katagiri, Kazumune ; Itokazu, Masaya</creator><creatorcontrib>Kaneshiro, Hideo ; Higa, Masaki ; Makabe, Chobin ; Katagiri, Kazumune ; Itokazu, Masaya</creatorcontrib><description>Fatigue properties of polycrystalline copper films subjected to pulsating stresses are investigated on the basis of observations of surface topography, fracture surface and dislocation structure. Fatigue limit corresponding to 107 cycles of a rolled copper film is 2. 3 times higher than that of an annealed one, but the fatigue limit ratio of the rolled specimen is lower than that of annealed one. From the observations of the surface crack and fracture surface, it is found that fatigue crack initiation and early-stage crack growth mechanisms of annealed bulk copper are not necessarily applicable to those of film. No striations are formed in both films. In annealed films, cell structures are formed under high-cycle fatigue whereas no band/ladder structures are formed. Dislocation structures near the fatigue crack in annealed films are similar to those of bulk specimens except for the absence of intensely elongated cells observed in the shear flow regions in the bulk specimen. No appreciable change during fatigue was found in the dislocation structures of rolled films.</description><identifier>ISSN: 0387-5008</identifier><identifier>EISSN: 1884-8338</identifier><identifier>DOI: 10.1299/kikaia.60.1325</identifier><language>eng ; jpn</language><publisher>The Japan Society of Mechanical Engineers</publisher><subject>Copper Film ; Crack Initiation ; Dislocation ; Fatigue ; Fracture Surface ; Nonferrous Metal ; Pulsating Stress ; Subgrain Structure</subject><ispartof>Transactions of the Japan Society of Mechanical Engineers Series A, 1994/06/25, Vol.60(574), pp.1325-1332</ispartof><rights>The Japan Society of Mechanical Engineers</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,1883,4024,27923,27924,27925</link.rule.ids></links><search><creatorcontrib>Kaneshiro, Hideo</creatorcontrib><creatorcontrib>Higa, Masaki</creatorcontrib><creatorcontrib>Makabe, Chobin</creatorcontrib><creatorcontrib>Katagiri, Kazumune</creatorcontrib><creatorcontrib>Itokazu, Masaya</creatorcontrib><title>Fatigue Properties and Dislocation Structures of Polycrystalline Copper Film</title><title>TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A</title><addtitle>JSMET</addtitle><description>Fatigue properties of polycrystalline copper films subjected to pulsating stresses are investigated on the basis of observations of surface topography, fracture surface and dislocation structure. Fatigue limit corresponding to 107 cycles of a rolled copper film is 2. 3 times higher than that of an annealed one, but the fatigue limit ratio of the rolled specimen is lower than that of annealed one. From the observations of the surface crack and fracture surface, it is found that fatigue crack initiation and early-stage crack growth mechanisms of annealed bulk copper are not necessarily applicable to those of film. No striations are formed in both films. In annealed films, cell structures are formed under high-cycle fatigue whereas no band/ladder structures are formed. Dislocation structures near the fatigue crack in annealed films are similar to those of bulk specimens except for the absence of intensely elongated cells observed in the shear flow regions in the bulk specimen. No appreciable change during fatigue was found in the dislocation structures of rolled films.</description><subject>Copper Film</subject><subject>Crack Initiation</subject><subject>Dislocation</subject><subject>Fatigue</subject><subject>Fracture Surface</subject><subject>Nonferrous Metal</subject><subject>Pulsating Stress</subject><subject>Subgrain Structure</subject><issn>0387-5008</issn><issn>1884-8338</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1994</creationdate><recordtype>article</recordtype><recordid>eNo9kEtPAjEUhRujiQTZuu4fGOxj-loaFDWSSKKuJ522g5UyJe3Mgn9vCcjq5Oae7-bcA8A9RnNMlHrY-q32es7LSAm7AhMsZV1JSuU1mCAqRcUQkrdglrNvEaJYYMTJBKyWevCb0cF1inuXBu8y1L2FTz6HaMou9vBzSKMZxlRWsYPrGA4mHfKgQ_C9g4u4LyBc-rC7AzedDtnNzjoF38vnr8Vrtfp4eVs8ripDRM0qS4QgRlGKEKldydkqbbmwnZRYIW5bJ1inaSs57VpiHaJKMtxKjBgS3NZ0CuanuybFnJPrmn3yO50ODUbNsY7mVEfDy1jqKMD7CfgtsTfuYtflYRPc2Y6VUEeEifpfjvTFZX50alxP_wAZWW53</recordid><startdate>1994</startdate><enddate>1994</enddate><creator>Kaneshiro, Hideo</creator><creator>Higa, Masaki</creator><creator>Makabe, Chobin</creator><creator>Katagiri, Kazumune</creator><creator>Itokazu, Masaya</creator><general>The Japan Society of Mechanical Engineers</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>1994</creationdate><title>Fatigue Properties and Dislocation Structures of Polycrystalline Copper Film</title><author>Kaneshiro, Hideo ; Higa, Masaki ; Makabe, Chobin ; Katagiri, Kazumune ; Itokazu, Masaya</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2745-d2772c9330024e884b9ad67df881906dbe75fa3b863fb2de039851b8105076d43</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng ; jpn</language><creationdate>1994</creationdate><topic>Copper Film</topic><topic>Crack Initiation</topic><topic>Dislocation</topic><topic>Fatigue</topic><topic>Fracture Surface</topic><topic>Nonferrous Metal</topic><topic>Pulsating Stress</topic><topic>Subgrain Structure</topic><toplevel>online_resources</toplevel><creatorcontrib>Kaneshiro, Hideo</creatorcontrib><creatorcontrib>Higa, Masaki</creatorcontrib><creatorcontrib>Makabe, Chobin</creatorcontrib><creatorcontrib>Katagiri, Kazumune</creatorcontrib><creatorcontrib>Itokazu, Masaya</creatorcontrib><collection>CrossRef</collection><jtitle>TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kaneshiro, Hideo</au><au>Higa, Masaki</au><au>Makabe, Chobin</au><au>Katagiri, Kazumune</au><au>Itokazu, Masaya</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Fatigue Properties and Dislocation Structures of Polycrystalline Copper Film</atitle><jtitle>TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A</jtitle><addtitle>JSMET</addtitle><date>1994</date><risdate>1994</risdate><volume>60</volume><issue>574</issue><spage>1325</spage><epage>1332</epage><pages>1325-1332</pages><issn>0387-5008</issn><eissn>1884-8338</eissn><abstract>Fatigue properties of polycrystalline copper films subjected to pulsating stresses are investigated on the basis of observations of surface topography, fracture surface and dislocation structure. Fatigue limit corresponding to 107 cycles of a rolled copper film is 2. 3 times higher than that of an annealed one, but the fatigue limit ratio of the rolled specimen is lower than that of annealed one. From the observations of the surface crack and fracture surface, it is found that fatigue crack initiation and early-stage crack growth mechanisms of annealed bulk copper are not necessarily applicable to those of film. No striations are formed in both films. In annealed films, cell structures are formed under high-cycle fatigue whereas no band/ladder structures are formed. Dislocation structures near the fatigue crack in annealed films are similar to those of bulk specimens except for the absence of intensely elongated cells observed in the shear flow regions in the bulk specimen. No appreciable change during fatigue was found in the dislocation structures of rolled films.</abstract><pub>The Japan Society of Mechanical Engineers</pub><doi>10.1299/kikaia.60.1325</doi><tpages>8</tpages><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0387-5008 |
| ispartof | Transactions of the Japan Society of Mechanical Engineers Series A, 1994/06/25, Vol.60(574), pp.1325-1332 |
| issn | 0387-5008 1884-8338 |
| language | eng ; jpn |
| recordid | cdi_crossref_primary_10_1299_kikaia_60_1325 |
| source | J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese; EZB-FREE-00999 freely available EZB journals |
| subjects | Copper Film Crack Initiation Dislocation Fatigue Fracture Surface Nonferrous Metal Pulsating Stress Subgrain Structure |
| title | Fatigue Properties and Dislocation Structures of Polycrystalline Copper Film |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T09%3A40%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-jstage_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Fatigue%20Properties%20and%20Dislocation%20Structures%20of%20Polycrystalline%20Copper%20Film&rft.jtitle=TRANSACTIONS%20OF%20THE%20JAPAN%20SOCIETY%20OF%20MECHANICAL%20ENGINEERS%20Series%20A&rft.au=Kaneshiro,%20Hideo&rft.date=1994&rft.volume=60&rft.issue=574&rft.spage=1325&rft.epage=1332&rft.pages=1325-1332&rft.issn=0387-5008&rft.eissn=1884-8338&rft_id=info:doi/10.1299/kikaia.60.1325&rft_dat=%3Cjstage_cross%3Earticle_kikaia1979_60_574_60_574_1325_article_char_en%3C/jstage_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |