Structural Optimization of Curved Image Sensor
The bending strength and surface strength of thin silicon devices and structural optimization of the curved image sensor were investigated in order to achieve high quality and thin camera module with high reliability. A new surface strength test method was proposed and the effects of the stress reli...
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Veröffentlicht in: | Journal of Solid Mechanics and Materials Engineering 2007, Vol.1(10), pp.1281-1292 |
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Format: | Artikel |
Sprache: | eng |
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