Electromechanical impedance based debond localisation in a composite sandwich structure

An electromechanical impedance (EMI) based structural health monitoring (SHM) approach is proposed for the localisation of skin-core debonds in composite sandwich structure (CSS). Towards this, laboratory experiments and numerical simulations of EMI in a CSS with core to bottom face-sheet debond hav...

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Veröffentlicht in:Journal of intelligent material systems and structures 2022-07, Vol.33 (12), p.1487-1496
Hauptverfasser: Sikdar, Shirsendu, Singh, Shishir Kumar, Malinowski, Paweł, Ostachowicz, Wiesław
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container_end_page 1496
container_issue 12
container_start_page 1487
container_title Journal of intelligent material systems and structures
container_volume 33
creator Sikdar, Shirsendu
Singh, Shishir Kumar
Malinowski, Paweł
Ostachowicz, Wiesław
description An electromechanical impedance (EMI) based structural health monitoring (SHM) approach is proposed for the localisation of skin-core debonds in composite sandwich structure (CSS). Towards this, laboratory experiments and numerical simulations of EMI in a CSS with core to bottom face-sheet debond have been carried out using a network of piezoelectric transducers (PZTs). The frequency-domain analysis of the registered EMI signals shows that the presence of inter-facial debonds in the CSS significantly influences the conductance magnitudes of the registered EMI data. It was also noticed that the conductance magnitudes of the signals are dependent on the debond-to-PZT distances. In all the study cases, an agreement between the simulation and experimental results is observed. Eventually, a simulated SHM approach is proposed that uses a debond detection algorithm to calculate the changes in conductance magnitudes to effectively locate such debonds in CSS. The study is further extended for the detection of debonds at different locations in the CSS, including a debond located at the edge to assess the potential of the proposed SHM approach.
doi_str_mv 10.1177/1045389X211057225
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title Electromechanical impedance based debond localisation in a composite sandwich structure
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