Influence of thermal annealing on structural, morphological, optical and electrical properties of NiO-Cu composite thin films
p-type NiO-Cu composite thin films were deposited using DC reactive magnetron sputtering technique. The deposited films were annealed in air at different temperatures and characterized for studying the structural, morphological, compositional, optical and electrical properties. X-ray diffraction ana...
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| Veröffentlicht in: | Materials express 2014-02, Vol.4 (1), p.32-40 |
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| creator | Reddy, Y. Ashok Kumar Ajitha Reddy, P. Sreedhara |
| description | p-type NiO-Cu composite thin films were deposited using DC reactive magnetron sputtering technique. The deposited films were annealed in air at different temperatures and characterized for studying the structural, morphological, compositional, optical and electrical properties.
X-ray diffraction analysis revealed that the crystallite size increased with increasing the annealing temperature and the films exhibited a stable cubic structure even at higher annealing temperatures. The X-ray photoelectron spectroscopy studies indicated that all the annealed films have
single phase NiO-Cu. Morphological studies showed that the grain size and roughness increased with increasing the annealing temperature. The annealed films exhibited high optical transmittance with lowest resistivity when compared to as deposited films. |
| doi_str_mv | 10.1166/mex.2014.1145 |
| format | Article |
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X-ray diffraction analysis revealed that the crystallite size increased with increasing the annealing temperature and the films exhibited a stable cubic structure even at higher annealing temperatures. The X-ray photoelectron spectroscopy studies indicated that all the annealed films have
single phase NiO-Cu. Morphological studies showed that the grain size and roughness increased with increasing the annealing temperature. The annealed films exhibited high optical transmittance with lowest resistivity when compared to as deposited films.</description><identifier>ISSN: 2158-5849</identifier><identifier>EISSN: 2158-5857</identifier><identifier>DOI: 10.1166/mex.2014.1145</identifier><language>eng</language><publisher>American Scientific Publishers</publisher><subject>Annealing Temperature ; Grain Size ; Nio-Cu Composite Films ; Resistivity ; Sputtering</subject><ispartof>Materials express, 2014-02, Vol.4 (1), p.32-40</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c358t-f91d964ac99b3a899d292ceb88e90b493c31110b3bb068f0e5db5d475676b3153</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>288,314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Reddy, Y. Ashok Kumar</creatorcontrib><creatorcontrib>Ajitha</creatorcontrib><creatorcontrib>Reddy, P. Sreedhara</creatorcontrib><title>Influence of thermal annealing on structural, morphological, optical and electrical properties of NiO-Cu composite thin films</title><title>Materials express</title><addtitle>Mat Express</addtitle><description>p-type NiO-Cu composite thin films were deposited using DC reactive magnetron sputtering technique. The deposited films were annealed in air at different temperatures and characterized for studying the structural, morphological, compositional, optical and electrical properties.
X-ray diffraction analysis revealed that the crystallite size increased with increasing the annealing temperature and the films exhibited a stable cubic structure even at higher annealing temperatures. The X-ray photoelectron spectroscopy studies indicated that all the annealed films have
single phase NiO-Cu. Morphological studies showed that the grain size and roughness increased with increasing the annealing temperature. The annealed films exhibited high optical transmittance with lowest resistivity when compared to as deposited films.</description><subject>Annealing Temperature</subject><subject>Grain Size</subject><subject>Nio-Cu Composite Films</subject><subject>Resistivity</subject><subject>Sputtering</subject><issn>2158-5849</issn><issn>2158-5857</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNo9kE9rwyAYh2VssNL1uLsfYOm00VQvg1H2p1DWy3YWNaZNMRrUwHbYd59pRt-Lv588vMoDwD1GS4yr6rEz38sVwiQ3Qq_AbIUpKyij6-tLJvwWLGI8oTyUMMzIDPxuXWMH47SBvoHpaEInLZTOGWlbd4DewZjCoNMQpH2AnQ_90Vt_aPVYfZ_GkPkaGmt0CufaB9-bkFoTx6Uf7b7YDFD7rvexTSa_0jrYtLaLd-CmkTaaxf85B1-vL5-b92K3f9tunneFLilLRcNxzSsiNeeqlIzzesVX2ijGDEeK8FKXGGOkSqVQxRpkaK1oTda0WleqxLScg2Laq4OPMZhG9KHtZPgRGIlRn8j6xKhPjPoy_zTxWYFxSYqTH4LLPxQy9pmdUDTNJWAhQzrflH8TJniG</recordid><startdate>20140201</startdate><enddate>20140201</enddate><creator>Reddy, Y. Ashok Kumar</creator><creator>Ajitha</creator><creator>Reddy, P. Sreedhara</creator><general>American Scientific Publishers</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20140201</creationdate><title>Influence of thermal annealing on structural, morphological, optical and electrical properties of NiO-Cu composite thin films</title><author>Reddy, Y. Ashok Kumar ; Ajitha ; Reddy, P. Sreedhara</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c358t-f91d964ac99b3a899d292ceb88e90b493c31110b3bb068f0e5db5d475676b3153</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Annealing Temperature</topic><topic>Grain Size</topic><topic>Nio-Cu Composite Films</topic><topic>Resistivity</topic><topic>Sputtering</topic><toplevel>online_resources</toplevel><creatorcontrib>Reddy, Y. Ashok Kumar</creatorcontrib><creatorcontrib>Ajitha</creatorcontrib><creatorcontrib>Reddy, P. Sreedhara</creatorcontrib><collection>CrossRef</collection><jtitle>Materials express</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Reddy, Y. Ashok Kumar</au><au>Ajitha</au><au>Reddy, P. Sreedhara</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence of thermal annealing on structural, morphological, optical and electrical properties of NiO-Cu composite thin films</atitle><jtitle>Materials express</jtitle><stitle>Mat Express</stitle><date>2014-02-01</date><risdate>2014</risdate><volume>4</volume><issue>1</issue><spage>32</spage><epage>40</epage><pages>32-40</pages><issn>2158-5849</issn><eissn>2158-5857</eissn><abstract>p-type NiO-Cu composite thin films were deposited using DC reactive magnetron sputtering technique. The deposited films were annealed in air at different temperatures and characterized for studying the structural, morphological, compositional, optical and electrical properties.
X-ray diffraction analysis revealed that the crystallite size increased with increasing the annealing temperature and the films exhibited a stable cubic structure even at higher annealing temperatures. The X-ray photoelectron spectroscopy studies indicated that all the annealed films have
single phase NiO-Cu. Morphological studies showed that the grain size and roughness increased with increasing the annealing temperature. The annealed films exhibited high optical transmittance with lowest resistivity when compared to as deposited films.</abstract><pub>American Scientific Publishers</pub><doi>10.1166/mex.2014.1145</doi><tpages>9</tpages></addata></record> |
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| subjects | Annealing Temperature Grain Size Nio-Cu Composite Films Resistivity Sputtering |
| title | Influence of thermal annealing on structural, morphological, optical and electrical properties of NiO-Cu composite thin films |
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