Cause and effect of void formation during vacuum bag curing of epoxy film adhesives

Void formation during vacuum bag curing of epoxy film adhesives arises from extraneous volatile products. Potential sources of volatiles were found to include organic solvents and/or water remaining in the adhesive from manufacture, water picked up by the adhesive prior to curing, and water retained...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Journal of adhesion science and technology 1998-01, Vol.12 (6), p.567-584
Hauptverfasser:	Pearce, P.J., Arnott, D.R., Camilleri, A., Kindermann, M.R., Mathys, G.I., Wilson, A.R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Application fields Applied sciences durability Epoxy film adhesives Exact sciences and technology mechanical properties Polymer industry, paints, wood Technology of polymers vacuum bag curing void formation
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!