X-Ray Photoelectron Spectroscopy Estimation of Cobalt Seed Layer Reactivity Toward Air Exposure: A Challenge?

For the last several generations of CMOS technology, copper has been used widely as an interconnect material in the back end of the line (BEOL). [1] [2] [3] As the current nodes technology are decreasing continuously, several copper scaling challenges appeared such as the Cu barrier thinning, the co...

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Veröffentlicht in:	Meeting abstracts (Electrochemical Society) 2020-05, Vol.MA2020-01 (15), p.1055-1055
Hauptverfasser:	Etcheberry, Arnaud, Lakhdari, Amine, Caillard, Louis, Suhr, Dominique, Thiam, Mikailou, Raynal, Frederic, Simon, Nathalie, Gonçalves, Anne-Marie, Mevellec, Vincent, Frégnaux, Mathieu
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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