Leveler Effect and Oscillatory Behavior during Copper Electroplating

The electrochemical behavior of levelers was studied and compared for two commercial Cu plating chemistries in an effort to correlate the electrochemical behaviors with their impacts on bottom-up filling, impurity incorporation, and grain structures. While a strong complexing between leveler and acc...

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Veröffentlicht in:	Journal of the Electrochemical Society 2012-01, Vol.159 (9), p.D526-D531
Hauptverfasser:	Huang, Q., Baker-O'Neal, B. C., Parks, C., Hopstaken, M., Fluegel, A., Emnet, C., Arnold, M., Mayer, D.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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