Design and Deep Insights into Sub-10 nm Spacer Engineered Junctionless FinFET for Nanoscale Applications
In this paper, we have studied the impact of various dielectric single-k (S-k) and dual-k (D-k) spacers on optimized Junctionless (JL) FinFET at nano-regime by using hetero-dielectric oxide based (HfxTi1−xO2) gate stack to enhance the sub-threshold performance of the device. Performance impact of ou...
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Veröffentlicht in: | ECS journal of solid state science and technology 2021-01, Vol.10 (1), p.13008 |
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description | In this paper, we have studied the impact of various dielectric single-k (S-k) and dual-k (D-k) spacers on optimized Junctionless (JL) FinFET at nano-regime by using hetero-dielectric oxide based (HfxTi1−xO2) gate stack to enhance the sub-threshold performance of the device. Performance impact of outer low-k spacer variation on D-k spacer by fixing inner high-k spacer has been reported. In this move, it is noticed that the ION/IOFF ratio shifted from 8.70 × 105 to 1.30 × 106 which is about ∼1.5x times improvement. Along with DC characteristics, analog/RF and linearity metrics are extracted and analysed. Due to a better gate electrostatic integrity (EI) at an extremely scaled L G , an optimally designed D-k spacer reveals a better DC and analog performance characteristics. The S-k spacer reveals a better performer in power consumption, dynamic power, RF, and linearity characteristics at nano scale. Furthermore, the scaling possibilities by spacers on DC and Analog performance at L G = 10 nm FinFET with tri-gate geometry at L G of 7 nm, 5 nm, and 3 nm are also examined. It has been noticed that the enhanced performance with the tri-gate structure is best suitable for future technological nodes. |
doi_str_mv | 10.1149/2162-8777/abddd4 |
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Performance impact of outer low-k spacer variation on D-k spacer by fixing inner high-k spacer has been reported. In this move, it is noticed that the ION/IOFF ratio shifted from 8.70 × 105 to 1.30 × 106 which is about ∼1.5x times improvement. Along with DC characteristics, analog/RF and linearity metrics are extracted and analysed. Due to a better gate electrostatic integrity (EI) at an extremely scaled L G , an optimally designed D-k spacer reveals a better DC and analog performance characteristics. The S-k spacer reveals a better performer in power consumption, dynamic power, RF, and linearity characteristics at nano scale. Furthermore, the scaling possibilities by spacers on DC and Analog performance at L G = 10 nm FinFET with tri-gate geometry at L G of 7 nm, 5 nm, and 3 nm are also examined. 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Solid State Sci. Technol</addtitle><description>In this paper, we have studied the impact of various dielectric single-k (S-k) and dual-k (D-k) spacers on optimized Junctionless (JL) FinFET at nano-regime by using hetero-dielectric oxide based (HfxTi1−xO2) gate stack to enhance the sub-threshold performance of the device. Performance impact of outer low-k spacer variation on D-k spacer by fixing inner high-k spacer has been reported. In this move, it is noticed that the ION/IOFF ratio shifted from 8.70 × 105 to 1.30 × 106 which is about ∼1.5x times improvement. Along with DC characteristics, analog/RF and linearity metrics are extracted and analysed. Due to a better gate electrostatic integrity (EI) at an extremely scaled L G , an optimally designed D-k spacer reveals a better DC and analog performance characteristics. The S-k spacer reveals a better performer in power consumption, dynamic power, RF, and linearity characteristics at nano scale. Furthermore, the scaling possibilities by spacers on DC and Analog performance at L G = 10 nm FinFET with tri-gate geometry at L G of 7 nm, 5 nm, and 3 nm are also examined. 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Due to a better gate electrostatic integrity (EI) at an extremely scaled L G , an optimally designed D-k spacer reveals a better DC and analog performance characteristics. The S-k spacer reveals a better performer in power consumption, dynamic power, RF, and linearity characteristics at nano scale. Furthermore, the scaling possibilities by spacers on DC and Analog performance at L G = 10 nm FinFET with tri-gate geometry at L G of 7 nm, 5 nm, and 3 nm are also examined. It has been noticed that the enhanced performance with the tri-gate structure is best suitable for future technological nodes.</abstract><pub>IOP Publishing</pub><doi>10.1149/2162-8777/abddd4</doi><tpages>10</tpages><orcidid>https://orcid.org/0000-0003-3064-1522</orcidid></addata></record> |
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title | Design and Deep Insights into Sub-10 nm Spacer Engineered Junctionless FinFET for Nanoscale Applications |
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