Evaluation of Properties of SiO 2 Films Fabricated by Plasma Oxidation
Properties of SiO2 films formed by plasma oxidation were compared with those of films formed by thermal oxidation. X-ray reflectivity (XRR) was used to evaluate the SiO2/Si interface roughness, thickness, and density of SiO2 films. Chemical properties of the SiO2 films were investigated by X-ray pho...
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Veröffentlicht in: | ECS transactions 2011-10, Vol.41 (3), p.169-175 |
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container_title | ECS transactions |
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creator | Yamaguchi, Takuya Nagata, Kohki Ogura, Atsushi Koganezawa, Tomoyuki Hirosawa, Ichiro Kabe, Yoshiro Sato, Yoshihiro Ishizuka, Shuuichi Hirota, Yoshihiro |
description | Properties of SiO2 films formed by plasma oxidation were compared with those of films formed by thermal oxidation. X-ray reflectivity (XRR) was used to evaluate the SiO2/Si interface roughness, thickness, and density of SiO2 films. Chemical properties of the SiO2 films were investigated by X-ray photoelectron spectroscopy (XPS). Moreover, the relation between film density and its chemical properties was evaluated. This evaluation shows that SiO2 films fabricated by plasma oxidation have higher density and a smoother interface than those fabricated by thermal oxidation. In addition, oxidation rate was increased and interface quality and density were improved by incorporating hydrogen in the plasma atmosphere. |
doi_str_mv | 10.1149/1.3633033 |
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title | Evaluation of Properties of SiO 2 Films Fabricated by Plasma Oxidation |
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