Low-Temperature Direct Bonding of Borosilicate, Fused Silica, and Functional Coatings

An experimental study of low-temperature bonding of plasma-treated borosilicate glass and fused silica wafers as well as silicon substrates carrying thin films of silicon dioxide, silicon nitride, silicon oxynitride, and indium tin oxide, respectively, is reported. Plasma process parameters were opt...

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Bibliographische Detailangaben

Hauptverfasser:	Eichler, Marko, Michel, Benedikt, Hennecke, Philipp, Gabriel, Markus, Klages, Claus-Peter
Format:	Tagungsbericht
Sprache:	eng
Online-Zugang:	Volltext
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