Reactive Bonding and Low Temperature Bonding of Heterogeneous Materials

This paper describes alternative low-temperature bonding procedures in Microsytems Technology. On the one hand reactive bonding is introduced, which is a relatively new joining technique for the mounting of microelectric components and the hermetic sealing of microelectronic packages. The usage of c...

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Bibliographische Detailangaben

Hauptverfasser:	Wiemer, Maik D., Braeuer, Jörg, Wünsch, Dirk, Gessner, Thomas
Format:	Tagungsbericht
Sprache:	eng
Online-Zugang:	Volltext
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