Thin Wafer Handling Challenges and Emerging Solutions

Temporary bonding attaches substrates to a carrier so that after thinning to the desired thickness further backside fabrications steps can be conducted with "normal" process flows in standard semiconductor equipment. The selection of a suitable temporary adhesive is key to the success of t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Farrens, Shari N., Bisson, Peter, Sood, Sumant, Hermanowski, James
Format:	Tagungsbericht
Sprache:	eng
Online-Zugang:	Volltext
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