Highly Selective SiGe Dry Etch Process for the Enablement of Stacked Nanosheet Gate-All-Around Transistors

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Veröffentlicht in:ECS transactions 2021-10, Vol.104 (4), p.217-227
Hauptverfasser: Durfee, Curtis, Kal, Subhadeep, Pancharatnam, Shanti, Bhuiyan, Maruf, Otto IV, Ivo, Flaugh, Matthew, Smith, Jeffrey, Chanemougame, Daniel, Alix, Cheryl, Zhou, Huimei, Frougier, Julien, Greene, Andrew, Belyansky, Michael, Watanabe, Koji, Zhang, Jingyun, Schmidt, Daniel, Breton, Mary, Zhao, Kai, Wang, Miaomiao, Basker, Veeraraghavan, Mosden, Aelan, Loubet, Nicolas, Guo, Dechao, Biolsi, Peter, Haran, Bala, Bu, Huiming
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container_end_page 227
container_issue 4
container_start_page 217
container_title ECS transactions
container_volume 104
creator Durfee, Curtis
Kal, Subhadeep
Pancharatnam, Shanti
Bhuiyan, Maruf
Otto IV, Ivo
Flaugh, Matthew
Smith, Jeffrey
Chanemougame, Daniel
Alix, Cheryl
Zhou, Huimei
Frougier, Julien
Greene, Andrew
Belyansky, Michael
Watanabe, Koji
Zhang, Jingyun
Schmidt, Daniel
Breton, Mary
Zhao, Kai
Wang, Miaomiao
Basker, Veeraraghavan
Mosden, Aelan
Loubet, Nicolas
Guo, Dechao
Biolsi, Peter
Haran, Bala
Bu, Huiming
description
doi_str_mv 10.1149/10404.0217ecst
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title Highly Selective SiGe Dry Etch Process for the Enablement of Stacked Nanosheet Gate-All-Around Transistors
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