Electrolyzed Sulfuric Acid Application in Semiconductor Cleaning Processes: An Advanced Substitution of SPM Cleaning

For SPM(Sulfuric acid Peroxide Mixture) cleaning, a widely used method in semiconductor process, the density of peroxide is the main factor for metal and polymer removal. As the technology node shrinks, the need for both better polymer removal performance and less for metal removal is required. Howe...

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Veröffentlicht in:ECS transactions 2017-04, Vol.77 (5), p.207-212
Hauptverfasser: Ahn, Jin-hyun, Kim, Pyung Dae, Hwang, Seong Cheol, Seo, Jinyoung, Lee, Sungjin, Ogawa, Yuichi, Ida, Junichi, Sasaki, Yuya, Nagai, Tatsuo, Otsu, Toru
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container_issue 5
container_start_page 207
container_title ECS transactions
container_volume 77
creator Ahn, Jin-hyun
Kim, Pyung Dae
Hwang, Seong Cheol
Seo, Jinyoung
Lee, Sungjin
Ogawa, Yuichi
Ida, Junichi
Sasaki, Yuya
Nagai, Tatsuo
Otsu, Toru
description For SPM(Sulfuric acid Peroxide Mixture) cleaning, a widely used method in semiconductor process, the density of peroxide is the main factor for metal and polymer removal. As the technology node shrinks, the need for both better polymer removal performance and less for metal removal is required. However, with only one factor is available for SPM cleaning. In this paper, by electrolysis of sulfuric acid, we utilized peroxydisulfate(S2O82-) instead of peroxide in semiconductor processes, resulting in better residue removal with same amount of metal removal.
doi_str_mv 10.1149/07705.0207ecst
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title Electrolyzed Sulfuric Acid Application in Semiconductor Cleaning Processes: An Advanced Substitution of SPM Cleaning
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