Low-k Reliability Improvement with Optimal Dummy Insertion

To improve low-k film reliability in BEOL, a process modeling methodology is employed to analyze stress and surface morphology evolution during BEOL fabrication process. The stress built-up in low-k dielectrics is found to be directly linked to material density increase, which correlates with labora...

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Bibliographische Detailangaben

Hauptverfasser:	Ma, Rice, Shi, XueJie, Xia, ChunQiu, Xu, XiaoPeng, Ni, Baibing, Chen, Larry
Format:	Tagungsbericht
Sprache:	eng
Online-Zugang:	Volltext
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