Cu Barrier Seed Innovation for EM Improvement

Cu barrier seed is a key process in Cu interconnect. Continuous improvement in Cu barrier and seed processes and hardware has enabled improvement in Cu gap fill and effective suppression of Cu diffusion and EM (electron migration). This paper addresses innovations in Cu barrier and seed aimed at sup...

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Bibliographische Detailangaben
Hauptverfasser: He, Weiye, Kang, Jian, Luo, Jeff, Wu, Grant, Zhang, Lei
Format: Tagungsbericht
Sprache:eng
Online-Zugang:Volltext
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