Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior

In chemical mechanical polishing (CMP), the slurry flow behavior on the polishing pad is very important both for improving polishing effectiveness and for reducing the slurry consumption. In this study, we aim to evaluate two types of CMP pad that have unique special groove patterns, slurry outflow...

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Veröffentlicht in:	Japanese Journal of Applied Physics 2012-05, Vol.51 (5), p.05EF03-05EF03-2
Hauptverfasser:	Yamazaki, Tsutomu, Doi, Toshiro K, Uneda, Michio, Kurokawa, Syuhei, Ohnishi, Osamu, Seshimo, Kiyoshi, Aida, Hideo
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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