Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior
In chemical mechanical polishing (CMP), the slurry flow behavior on the polishing pad is very important both for improving polishing effectiveness and for reducing the slurry consumption. In this study, we aim to evaluate two types of CMP pad that have unique special groove patterns, slurry outflow...
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| Veröffentlicht in: | Japanese Journal of Applied Physics 2012-05, Vol.51 (5), p.05EF03-05EF03-2 |
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| container_end_page | 05EF03-2 |
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| container_issue | 5 |
| container_start_page | 05EF03 |
| container_title | Japanese Journal of Applied Physics |
| container_volume | 51 |
| creator | Yamazaki, Tsutomu Doi, Toshiro K Uneda, Michio Kurokawa, Syuhei Ohnishi, Osamu Seshimo, Kiyoshi Aida, Hideo |
| description | In chemical mechanical polishing (CMP), the slurry flow behavior on the polishing pad is very important both for improving polishing effectiveness and for reducing the slurry consumption. In this study, we aim to evaluate two types of CMP pad that have unique special groove patterns, slurry outflow and inflow pads, for controlling the slurry flow behavior. We describe the effect of the groove patterns on the slurry flow behavior observed using images recorded using a high-speed digital camera. The results of the study indicate several advantages of the proposed pads over the conventional pads from the viewpoint of slurry flow behavior. |
| doi_str_mv | 10.1143/JJAP.51.05EF03 |
| format | Article |
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In this study, we aim to evaluate two types of CMP pad that have unique special groove patterns, slurry outflow and inflow pads, for controlling the slurry flow behavior. We describe the effect of the groove patterns on the slurry flow behavior observed using images recorded using a high-speed digital camera. The results of the study indicate several advantages of the proposed pads over the conventional pads from the viewpoint of slurry flow behavior.</description><identifier>ISSN: 0021-4922</identifier><identifier>EISSN: 1347-4065</identifier><identifier>DOI: 10.1143/JJAP.51.05EF03</identifier><language>eng</language><publisher>The Japan Society of Applied Physics</publisher><ispartof>Japanese Journal of Applied Physics, 2012-05, Vol.51 (5), p.05EF03-05EF03-2</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c295t-5b86d0f8d1ab84b107995e869459aeb134b352824d7c6dee14a5b2b8a3d9434d3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids></links><search><creatorcontrib>Yamazaki, Tsutomu</creatorcontrib><creatorcontrib>Doi, Toshiro K</creatorcontrib><creatorcontrib>Uneda, Michio</creatorcontrib><creatorcontrib>Kurokawa, Syuhei</creatorcontrib><creatorcontrib>Ohnishi, Osamu</creatorcontrib><creatorcontrib>Seshimo, Kiyoshi</creatorcontrib><creatorcontrib>Aida, Hideo</creatorcontrib><title>Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior</title><title>Japanese Journal of Applied Physics</title><description>In chemical mechanical polishing (CMP), the slurry flow behavior on the polishing pad is very important both for improving polishing effectiveness and for reducing the slurry consumption. 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In this study, we aim to evaluate two types of CMP pad that have unique special groove patterns, slurry outflow and inflow pads, for controlling the slurry flow behavior. We describe the effect of the groove patterns on the slurry flow behavior observed using images recorded using a high-speed digital camera. The results of the study indicate several advantages of the proposed pads over the conventional pads from the viewpoint of slurry flow behavior.</abstract><pub>The Japan Society of Applied Physics</pub><doi>10.1143/JJAP.51.05EF03</doi></addata></record> |
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| identifier | ISSN: 0021-4922 |
| ispartof | Japanese Journal of Applied Physics, 2012-05, Vol.51 (5), p.05EF03-05EF03-2 |
| issn | 0021-4922 1347-4065 |
| language | eng |
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| source | IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link |
| title | Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior |
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