High-Current Reliability of Carbon Nanotube Via Interconnects

We have improved the high-current reliability of carbon nanotube (CNT) via interconnects by chemical mechanical polishing (CMP) and vacuum in situ metal deposition processes. These processes enable us to decrease the contact resistance of a CNT via to the upper and lower Cu lines, and also increase...

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Veröffentlicht in:	Japanese Journal of Applied Physics 2010-10, Vol.49 (10), p.105102-105102-4
Hauptverfasser:	Sato, Motonobu, Hyakushima, Takashi, Kawabata, Akio, Nozue, Tatsuhiro, Sato, Shintaro, Nihei, Mizuhisa, Awano, Yuji
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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