Effect of Pulse-Reverse Current on Microstructure and Properties of Electroformed Nickel–Iron Mold Insert

A high-technology approach to the manufacture of microdevices and Ni–Fe films formed by electroforming processes was investigated. The properties of Ni–Fe films were evaluated by stress measurement, transmission electron microscopy (TEM), scanning probe microscopy (SPM) and nanoindentation analysis....

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Veröffentlicht in:	Japanese Journal of Applied Physics 2005-02, Vol.44 (2R), p.1086
Hauptverfasser:	Yeh, Yih-Min, Chen, Chin-Sung, Tsai, Ming-Hung, Shyng, Yih-Chuen, Lee, Sheng-Yang, Ou, Keng-Liang
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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