A cleaning model for removal of particles due to laser-induced thermal expansion of substrate surface
Taking Van der Waals force and cleaning force due to fast thermal expansion of substrate surface induced by pulsed laser irradiation into account, a cleaning model was established for removal of tiny particles from substrate surfaces. The cleaning condition and cleaning threshold can be obtained fro...
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| Veröffentlicht in: | Japanese Journal of Applied Physics 1997-10, Vol.36 (10A), p.L1304-L1306 |
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| Hauptverfasser: | , , , , , |
| Format: | Artikel |
| Sprache: | eng |
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| container_end_page | L1306 |
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| container_issue | 10A |
| container_start_page | L1304 |
| container_title | Japanese Journal of Applied Physics |
| container_volume | 36 |
| creator | LU, Y.-F SONG, W.-D YE, K.-D LEE, Y.-P CHAN, D. S. H LOW, T.-S |
| description | Taking Van der Waals force and cleaning force due to fast thermal expansion of substrate surface induced by pulsed laser irradiation into account, a cleaning model was established for removal of tiny particles from substrate surfaces. The cleaning condition and cleaning threshold can be obtained from this model. Theoretical predictions have been verified by the experimental results for removing quartz particles from silicon substrate. For laser-induced removal of quartz particles from silicon substrate surfaces, the cleaning threshold is about 135 mJ/cm
2
. Cleaning efficiency increases with increasing laser fluence, and large particles can be removed more easily than small ones. |
| doi_str_mv | 10.1143/jjap.36.L1304 |
| format | Article |
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2
. Cleaning efficiency increases with increasing laser fluence, and large particles can be removed more easily than small ones.</description><identifier>ISSN: 0021-4922</identifier><identifier>EISSN: 1347-4065</identifier><identifier>DOI: 10.1143/jjap.36.L1304</identifier><identifier>CODEN: JJAPA5</identifier><language>eng</language><publisher>Tokyo: Japanese journal of applied physics</publisher><subject>Cross-disciplinary physics: materials science; rheology ; Exact sciences and technology ; Materials science ; Physics ; Surface cleaning, etching, patterning ; Surface treatments</subject><ispartof>Japanese Journal of Applied Physics, 1997-10, Vol.36 (10A), p.L1304-L1306</ispartof><rights>1997 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c412t-48a547911c373c5c06c5fab1154e4f93251ff929ab764c62330ecddfd41e03bb3</citedby><cites>FETCH-LOGICAL-c412t-48a547911c373c5c06c5fab1154e4f93251ff929ab764c62330ecddfd41e03bb3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=2850502$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>LU, Y.-F</creatorcontrib><creatorcontrib>SONG, W.-D</creatorcontrib><creatorcontrib>YE, K.-D</creatorcontrib><creatorcontrib>LEE, Y.-P</creatorcontrib><creatorcontrib>CHAN, D. S. H</creatorcontrib><creatorcontrib>LOW, T.-S</creatorcontrib><title>A cleaning model for removal of particles due to laser-induced thermal expansion of substrate surface</title><title>Japanese Journal of Applied Physics</title><description>Taking Van der Waals force and cleaning force due to fast thermal expansion of substrate surface induced by pulsed laser irradiation into account, a cleaning model was established for removal of tiny particles from substrate surfaces. The cleaning condition and cleaning threshold can be obtained from this model. Theoretical predictions have been verified by the experimental results for removing quartz particles from silicon substrate. For laser-induced removal of quartz particles from silicon substrate surfaces, the cleaning threshold is about 135 mJ/cm
2
. Cleaning efficiency increases with increasing laser fluence, and large particles can be removed more easily than small ones.</description><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Exact sciences and technology</subject><subject>Materials science</subject><subject>Physics</subject><subject>Surface cleaning, etching, patterning</subject><subject>Surface treatments</subject><issn>0021-4922</issn><issn>1347-4065</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1997</creationdate><recordtype>article</recordtype><recordid>eNo9kL1PwzAUxC0EEqUwsntgTfHzV5qxqviqKsEAc_TiPEOqJI7sFMF_T0oR091Jv7vhGLsGsQDQ6na3w2Gh7GILSugTNgOl80wLa07ZTAgJmS6kPGcXKe2maI2GGaMVdy1h3_TvvAs1tdyHyCN14RNbHjwfMI7NhCRe74mPgbeYKGZNX-8d1Xz8oNhNJH0N2Kcm9IdO2ldpjDjS5KJHR5fszGOb6OpP5-zt_u51_Zhtnx-e1qtt5jTIMdNLNDovAJzKlTNOWGc8VgBGk_aFkga8L2SBVW61s1IpQa6ufa2BhKoqNWfZcdfFkFIkXw6x6TB-lyDKw0flZrN6KZUtfz-a-JsjP2By2PqIvWvSf0kujTBCqh8tVWhH</recordid><startdate>19971001</startdate><enddate>19971001</enddate><creator>LU, Y.-F</creator><creator>SONG, W.-D</creator><creator>YE, K.-D</creator><creator>LEE, Y.-P</creator><creator>CHAN, D. S. H</creator><creator>LOW, T.-S</creator><general>Japanese journal of applied physics</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>19971001</creationdate><title>A cleaning model for removal of particles due to laser-induced thermal expansion of substrate surface</title><author>LU, Y.-F ; SONG, W.-D ; YE, K.-D ; LEE, Y.-P ; CHAN, D. S. H ; LOW, T.-S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c412t-48a547911c373c5c06c5fab1154e4f93251ff929ab764c62330ecddfd41e03bb3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1997</creationdate><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Exact sciences and technology</topic><topic>Materials science</topic><topic>Physics</topic><topic>Surface cleaning, etching, patterning</topic><topic>Surface treatments</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>LU, Y.-F</creatorcontrib><creatorcontrib>SONG, W.-D</creatorcontrib><creatorcontrib>YE, K.-D</creatorcontrib><creatorcontrib>LEE, Y.-P</creatorcontrib><creatorcontrib>CHAN, D. S. H</creatorcontrib><creatorcontrib>LOW, T.-S</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>Japanese Journal of Applied Physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>LU, Y.-F</au><au>SONG, W.-D</au><au>YE, K.-D</au><au>LEE, Y.-P</au><au>CHAN, D. S. H</au><au>LOW, T.-S</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A cleaning model for removal of particles due to laser-induced thermal expansion of substrate surface</atitle><jtitle>Japanese Journal of Applied Physics</jtitle><date>1997-10-01</date><risdate>1997</risdate><volume>36</volume><issue>10A</issue><spage>L1304</spage><epage>L1306</epage><pages>L1304-L1306</pages><issn>0021-4922</issn><eissn>1347-4065</eissn><coden>JJAPA5</coden><abstract>Taking Van der Waals force and cleaning force due to fast thermal expansion of substrate surface induced by pulsed laser irradiation into account, a cleaning model was established for removal of tiny particles from substrate surfaces. The cleaning condition and cleaning threshold can be obtained from this model. Theoretical predictions have been verified by the experimental results for removing quartz particles from silicon substrate. For laser-induced removal of quartz particles from silicon substrate surfaces, the cleaning threshold is about 135 mJ/cm
2
. Cleaning efficiency increases with increasing laser fluence, and large particles can be removed more easily than small ones.</abstract><cop>Tokyo</cop><pub>Japanese journal of applied physics</pub><doi>10.1143/jjap.36.L1304</doi></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0021-4922 |
| ispartof | Japanese Journal of Applied Physics, 1997-10, Vol.36 (10A), p.L1304-L1306 |
| issn | 0021-4922 1347-4065 |
| language | eng |
| recordid | cdi_crossref_primary_10_1143_JJAP_36_L1304 |
| source | IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link |
| subjects | Cross-disciplinary physics: materials science rheology Exact sciences and technology Materials science Physics Surface cleaning, etching, patterning Surface treatments |
| title | A cleaning model for removal of particles due to laser-induced thermal expansion of substrate surface |
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