Reduction of charge build-up with high-power pulsed electron cyclotron resonance plasma
Local side etch is one of the most significant problems in high-density plasma and low energy processing. In this paper, we report a detailed analysis of etching characteristics under various modulations and microwave conditions to achieve simultaneously no local side etch, a high etch rate and a hi...
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Veröffentlicht in: | Japanese Journal of Applied Physics 1997-04, Vol.36 (4B), p.2526-2532 |
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container_title | Japanese Journal of Applied Physics |
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creator | MARUYAMA, T FUJIWARA, N OGINO, S YONEDA, M |
description | Local side etch is one of the most significant problems in high-density plasma and low energy processing. In this paper, we report a detailed analysis of etching characteristics under various modulations and microwave conditions to achieve simultaneously no local side etch, a high etch rate and a high selectivity. In addition, we discuss the mechanism of the reduction of local side etch using a new method to estimate charge build-up. |
doi_str_mv | 10.1143/jjap.36.2526 |
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In this paper, we report a detailed analysis of etching characteristics under various modulations and microwave conditions to achieve simultaneously no local side etch, a high etch rate and a high selectivity. In addition, we discuss the mechanism of the reduction of local side etch using a new method to estimate charge build-up.</description><identifier>ISSN: 0021-4922</identifier><identifier>EISSN: 1347-4065</identifier><identifier>DOI: 10.1143/jjap.36.2526</identifier><identifier>CODEN: JJAPA5</identifier><language>eng</language><publisher>Tokyo: Japanese journal of applied physics</publisher><subject>Applied sciences ; Electronics ; Exact sciences and technology ; Microelectronic fabrication (materials and surfaces technology) ; Semiconductor electronics. Microelectronics. Optoelectronics. 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In this paper, we report a detailed analysis of etching characteristics under various modulations and microwave conditions to achieve simultaneously no local side etch, a high etch rate and a high selectivity. In addition, we discuss the mechanism of the reduction of local side etch using a new method to estimate charge build-up.</description><subject>Applied sciences</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. 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Microelectronics. Optoelectronics. Solid state devices</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>MARUYAMA, T</creatorcontrib><creatorcontrib>FUJIWARA, N</creatorcontrib><creatorcontrib>OGINO, S</creatorcontrib><creatorcontrib>YONEDA, M</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>Japanese Journal of Applied Physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>MARUYAMA, T</au><au>FUJIWARA, N</au><au>OGINO, S</au><au>YONEDA, M</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Reduction of charge build-up with high-power pulsed electron cyclotron resonance plasma</atitle><jtitle>Japanese Journal of Applied Physics</jtitle><date>1997-04-01</date><risdate>1997</risdate><volume>36</volume><issue>4B</issue><spage>2526</spage><epage>2532</epage><pages>2526-2532</pages><issn>0021-4922</issn><eissn>1347-4065</eissn><coden>JJAPA5</coden><abstract>Local side etch is one of the most significant problems in high-density plasma and low energy processing. In this paper, we report a detailed analysis of etching characteristics under various modulations and microwave conditions to achieve simultaneously no local side etch, a high etch rate and a high selectivity. In addition, we discuss the mechanism of the reduction of local side etch using a new method to estimate charge build-up.</abstract><cop>Tokyo</cop><pub>Japanese journal of applied physics</pub><doi>10.1143/jjap.36.2526</doi><tpages>7</tpages></addata></record> |
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source | Institute of Physics Journals |
subjects | Applied sciences Electronics Exact sciences and technology Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
title | Reduction of charge build-up with high-power pulsed electron cyclotron resonance plasma |
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