Very low temperature deposition of polycrystalline Si films fabricated by hydrogen dilution with electron cyclotron resonance chemical vapor deposition
Characteristics of polycrystalline silicon films deposited both on SiO 2 and Corning 7059 glass substrates are presented in this paper. The silicon films were deposited by a hydrogen dilution method using electron cyclotron resonance chemical vapor deposition at 250° C without any thermal or laser a...
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Veröffentlicht in: | Japanese Journal of Applied Physics 1995-02, Vol.34 (2B), p.927-931 |
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Sprache: | eng |
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