Cell projection lithography with scattering contrast

A scattering-type cell projection method is proposed and its characteristics are estimated by simulation and experiment. In this method, a mask consisting of thin scatterers and apertures is used to shape an electron beam. Thus, this method has advantages over the conventional cell projection method...

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Veröffentlicht in:Japanese Journal of Applied Physics 1994-12, Vol.33 (12B), p.6940-6945
Hauptverfasser: SOHDA, Y, SOMEDA, Y, SATOH, H, NAKAYAMA, Y, SAITOU, N, ITOH, H
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container_end_page 6945
container_issue 12B
container_start_page 6940
container_title Japanese Journal of Applied Physics
container_volume 33
creator SOHDA, Y
SOMEDA, Y
SATOH, H
NAKAYAMA, Y
SAITOU, N
ITOH, H
description A scattering-type cell projection method is proposed and its characteristics are estimated by simulation and experiment. In this method, a mask consisting of thin scatterers and apertures is used to shape an electron beam. Thus, this method has advantages over the conventional cell projection method. First, a high aspect ratio is not necessary to fabricate the mask. Thus, the mask pattern is easily fabricated and its experimental dimensional accuracy is better than 0.2 µ m. Second, the simulated heat deposition on the mask drastically decreases. In addition, simulation and experiment show good contrast of over 10 5 related to using a limiting aperture to intercept scattered electrons. As a result, this method is considered to be a key technology in future electron beam lithography systems.
doi_str_mv 10.1143/jjap.33.6940
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source IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link
subjects Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title Cell projection lithography with scattering contrast
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