Formation and desorption of nickel hexafluoroacetylacetonate Ni(hfac)2 on a nickel oxide surface in atomic layer etching processes

Thermal atomic layer etching (ALE) of nickel (Ni) may be performed with a step of thin-layer oxidation of its surface and another step of its removal by gas-phase hexafluoroacetylacetone (hfacH) as an etchant. In this study, adsorption of hfacH and possible formation of volatile nickel hexafluoroacetylacetonate Ni(hfac)2 on a NiO surface were investigated based on the density functional theory (DFT) with more realistic surface material models than those used in the previous study [A. H. Basher et al., J. Vac. Sci. Technol. A 38, 022610 (2020)]. It has been confirmed that an hfacH molecule approaching a NiO surface deprotonates without a potential barrier and adsorbs on the surface exothermically. In addition, stable adsorption of two deprotonated hfacH molecules on a NiO (100) surface was found to occur not on a single Ni atom but over a few Ni atoms instead, which makes the formation of a Ni(hfac)2 complex on the flat surface very unlikely even at elevated temperature. However, if the surface is rough and a Ni atom protrudes from the surrounding atoms, two hexafluoroacetylacetonate anions (hfac−) can bond to the Ni atom stably, which suggests a possibility of desorption of a Ni(hfac)2 complex from the surface at elevated temperature. Given the experimentally observed fact that desorption of Ni(hfac)2 complexes typically takes place on a NiO surface at a temperature of ∼300–400 °C, our DFT calculations indicate that the surface roughness of an oxidized Ni surface facilitates the formation and desorption of organometallic complexes Ni(hfac)2, and therefore, the resulting Ni surface after ALE can be smoother than the initial surface.