Vacuum sealing using atomic layer deposition of Al2O3 at 250 °C

This paper describes the use of low-temperature atomic layer deposition (ALD) of Al2O3, for vacuum seals in wafer-level vacuum packaging and other applications. The conformal coverage provided by ALD Al2O3 is shown to seal circular micromachined cavities. The cavities are 0.8 μm in height, 400 μm in...

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Veröffentlicht in:	Journal of vacuum science & technology. A, Vacuum, surfaces, and films Vacuum, surfaces, and films, 2014-01, Vol.32 (1)
Hauptverfasser:	An, Seungdo, Gupta, Naveen K., Gianchandani, Yogesh B.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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