Effect of plasma treatments on a low- k dielectric polymer surface

The ongoing transition to lower dimension devices requires the replacement of Si O 2 by a lower- k dielectric insulator. Such materials are porous, introducing the need for sealing against penetration of gaseous and/or liquid species during subsequent processing. In this work, we investigate the eff...

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Veröffentlicht in:	Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 2005-07, Vol.23 (4), p.1551-1557
Hauptverfasser:	Hoyas, A. Martin, Schuhmacher, J., Whelan, C. M., Baklanov, M. R., Carbonell, L., Celis, J. P., Maex, K.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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