Integration and electrical characterization of photosensitive polyimide

A base line process of photosensitive polyimide was developed to significantly reduce cycle time in backend polyimide processes as compared to the use of conventional nonphotosensitive polyimide. A 6 μm resolution was obtained by the use of a wet etch process of photosensitive polyimide (PSPI) in aq...

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Veröffentlicht in:	Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 2001-05, Vol.19 (3), p.774-779
Hauptverfasser:	Alford, T. L., Zou, Y. L., Gadre, Kaustubh S., King, C., Chen, W., Theodore, N. David
Format:	Artikel
Sprache:	eng
Schlagworte:	Etching Interfaces (materials) Leakage currents Moisture Photosensitivity
Online-Zugang:	Volltext
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