Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package Environment

Long term package reliability is becoming an increasing concern as IC clock speeds and power densities increase while simultaneously the package foot print decreases. Significant contributors to increasing the reliability and performance of plastic packages are reducing the package/junction temperat...

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Veröffentlicht in:	Journal of electronic packaging 2000-06, Vol.122 (2), p.92-97
Hauptverfasser:	Fabis, Philip M, Windischmann, Henry
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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