Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
Accelerated testing has been executed to examine the combined influence of electromigration (EM) stressors (elevated current density and elevated ambient temperature) and tensile stress on the lifetime of SAC305 solder joints (300 μm diameter) at two current densities (8500 and 9100 A/cm2), two ambi...
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| Veröffentlicht in: | Journal of electronic packaging 2025-03, Vol.147 (1) |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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