Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
Convective heat transfer by jet impingement cooling offers a suitable solution for high heat flux applications. Compared to techniques that rely on bulk conduction in series with convection, direct liquid impingement reduces the thermal resistance between power device hot spots and the coolant. Alth...
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| Veröffentlicht in: | Journal of electronic packaging 2024-12, Vol.146 (4) |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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