Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Over the last several decades, cooling technologies have been developed to address the growing thermal challenges associated with high-powered electronics. However, within the next several years, the heat generated by these devices is predicted to exceed 1 kW/cm2, and traditional methods, such as ai...

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Veröffentlicht in:	Journal of electronic packaging 2021-12, Vol.143 (4)
Hauptverfasser:	Guye, Kidus, Dong, De, Kim, Yunseo, Lee, Hyoungsoon, Dogruoz, Baris, Agonafer, Damena
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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