A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

This paper presents a new approach to formulating an analytical model for the underfill process in flip-chip packaging to predict the flow front and the filling time. The new approach is based on the concept of surface energy along with the energy conservation principle. This approach avoids the nee...

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Veröffentlicht in:	Journal of electronic packaging 2022-12, Vol.144 (4)
Hauptverfasser:	Yao, Xingjun, Jiang, Weijie, Yang, Jiahui, Fang, Junjie, Zhang, Wenjun
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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