Review of Methodologies for Structural Integrity Evaluation of Power Modules

This paper reviews the previous research on the methodologies for evaluating structural integrity of wire bonds and die-attachments in power modules. Under power module operation, these parts are subjected to repeated temperature variations which induce repeated thermal stress due to the mismatch in...

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Veröffentlicht in:	Journal of electronic packaging 2021-06, Vol.143 (2)
Hauptverfasser:	Miyazaki, Noriyuki, Shishido, Nobuyuki, Hayama, Yutaka
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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